Hinton Innovation
Thermal test platform, fully assembled: microgap cooling device mounted over an instrumented heater microchip on a custom PCB
Microgap cooling device held mid-air, underside toward the viewer, showing the microgap plate features and fluid inlet and outlet
Instrumented heater microchip face-on, midway through peeling its microfabricated layers
Complete microfabricated silicon wafer for the instrumented heater with the die grid and auxiliary features
Custom thermal test platform PCB, top face, with exposed solder pads for the instrumented heater microchip and connectors

Consulting & Development Lab

Hinton Innovation — thermofluids, microtech and AI consulting and development lab

  • Thermofluids
  • Microtech
  • AI
SHEET 01 / 05
Thermal test platform
Systems engineering

A complete processor cooling research system, including novel microgap and instrumented heater microchip technology. We own every stage of development: design, fabrication, and testing.

Example showcase work.

SHEET 02 / 05
Microgap cooling device
Thermal · Fluids

Coolant flows directly over the processor through microgaps as small as 50 µm. Tested to 350 W/cm², outperforming comparable microchannel devices.

Patent — US 11,507,153 · CA 3140764, invented by M. Hinton & L. Mydlarski, assigned to Hypertec

SHEET 03 / 05
Instrumented heater microchip
Microtechnology

Emulates the heat surface profiles of real computer processors by way of a microfabricated 9×9 grid of self-contained cells, each with its own heater, temperature sensor, and external connections.

Patent pending — WO 2025/086019, invented by M. Hinton & L. Mydlarski, assigned to M. Hinton

SHEET 04 / 05
Microfabricated silicon wafer
Micro- & Nano-fabrication

Built with the same thin films, silicon wafers, and cleanroom processes as real microprocessors, maximizing the fidelity of the emulation.

SHEET 05 / 05
Test platform PCB
Electrical

Custom board that routes the platform's independently powered heater cells and temperature sensor array to the data acquisition and control system.

Expertise

Three core disciplines, on a foundation of technical practice and innovation.

01

Thermofluids

  • Heat transfer & fluid mechanics
  • Thermal management & thermofluid systems
  • Processor & electronics cooling
  • Single- & two-phase flow
  • Microgap & spray cooling
  • Flow visualization & characterization
02

Microtechnology

  • Cleanroom microfabrication: thin film deposition, photolithography, wet & dry etching, etc.
  • Nano- and micro-scale feature & fabrication process design
  • Microchips & microdevices
  • Thin film sensors
  • Microfluidics
03

AI & Software

  • Agentic systems & workflows
  • Automation
  • AI-accelerated development
  • Machine learning
  • AI strategy & adoption
  • Data acquisition & control software
  • Applied software development
Foundation
Technical practice
  • Design
  • Simulation & numerical modeling
  • Prototyping
  • System integration
  • Testing & validation
  • Design of experiments (DOE)
  • Measurement & instrumentation
  • Product development
Innovation
  • Ideation
  • Research & development (R&D)
  • Novel technology & process development
  • Patents & IP strategy
  • Grants & R&D funding
  • Technology & innovation strategy
Additional specialties
  • Technical due diligence
  • Scientific advisement
  • CAD
  • PCB design
  • Design for manufacturability
  • Embedded systems
  • Automation & control
  • Metrology & characterization
  • Calibration & uncertainty analysis
  • Failure analysis
  • Data analysis & modeling
  • High-performance computing
  • Data center technologies
  • Information technology
  • Energy efficiency & sustainability
  • Deep tech
Portrait of Michael Hinton
Principal Michael Hinton
Credentials
  • PhD in Mechanical Engineering, McGill
  • 10+ years in R&D
  • Former Scientific Director at a leading data center & computing technology company
  • 2 patents granted · 2 pending
  • 100% grant success rate, including IRAP and Mitacs

Innovation is at the heart of everything we do.

Selected work

Built, measured, proven.

Instrumented heater microchips: two diced silicon chips resting in a foam-lined case
FIG. 01Instrumented heater microchips
Wafer heater layer in cleanroom light, the die grid visible across the wafer
FIG. 02Wafer heater layer in cleanroom light
Flow visualization: coolant moving over a transparent viewport
FIG. 03Flow visualization
Microgap cooling device installed on the thermal test platform
FIG. 04Installed microgap cooling device
Signal conditioning board, a custom circuit board with its components populated
FIG. 05Signal conditioning board
Instrumented heater cell under microscope, showing the cell components
FIG. 06Instrumented heater cell under microscope
Ribbed microgap plate, held between finger and thumb to show its ribs and other features
FIG. 07Ribbed microgap plate
Thermal test platform PCBA, fully assembled
FIG. 08Thermal test platform PCBA
Wafer temperature sensor layer, patterned across the die grid
FIG. 09Wafer temperature sensor layer
Solder-balled instrumented heater chip, the ball grid covering its face
FIG. 10Solder-balled instrumented heater chip
Wafer pre-dicing, complete with its pad openings exposed
FIG. 11Wafer pre-dicing
Control electronics enclosure, opened to show its DIN-rail power supplies, circuits, and wiring
FIG. 12Control electronics enclosure
Power distribution enclosure, opened to show its terminal rails, resistors, fuses, and wiring
FIG. 13Power distribution enclosure
Processor cooling test apparatus: the flow loop with its pump, instrumentation and thermal test platform
FIG. 14Processor cooling test apparatus
Thermal test platform with added thermal insulation
FIG. 15Thermal test platform with insulation

Client work stays confidential — shown here is what we can share publicly, mainly drawn from M. Hinton's doctoral thesis.

Contact

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